H. Lee

FULLY EMBEDDED COMPACT DIPLEXER INTO ORGANIC PACKAGE SUBSTRATE FOR DUAL-MODE (GSM/DCS) HANDSET APPLICATIONS

J. Park, D. Park, H. Lee, 2007 .

SURFACE MICROMACHINED HIGH FREQUENCY INDUCTORS IN ELECTROPLATING AND SCREEN-PRINTING PROCESSES

J. Park, H. Lee, 2005 .

Analysis of Device Characteristics of NMOSFETs on Fluorine Implantation

H. Lee, Jae‐Hyung Jang, Sungkyu Kwon, 2012 .

Investigating the Wafer Temperature in an Atmospheric-Pressure Plasma Process

G. Kwon, H. Lee, Woo-Jae Kim, 2020, Journal of the Korean Physical Society.

Plasma Etching of Silicon at a High Flow and a High Pressure of NF3 in Reactive Ion Etching

Min-Ho Kang, G. Kwon, H. Lee, 2019, Journal of the Korean Physical Society.

Characterization of Fully Embedded RF Inductors in Organic SOP Technology

Hwan-Hee Lee, Jae-Yeong Park, Jae-Yeong Park, 2009, IEEE Transactions on Advanced Packaging.