C. Shute

发表

Determination of yielding and debonding in Al–Cu thin films from residual stress measurements via diffraction

J. Cohen, C. Shute, 1991 .

Stress relaxation in AlCu thin films

J. Cohen, C. Shute, 1992 .

Probing structures of nanomaterials using advanced electron microscopy methods, including aberration‐corrected electron microscopy at the angstrom scale

X. Jia, M. Dresselhaus, J. Weertman, 2011, Microscopy research and technique.

Residual stresses and fracture properties of magnetron sputtered Ti films on Si microelements

J. Schweitz, S. Johansson, L. Hultman, 1993 .

High-pressure torsion of copper samples containing columns of highly aligned nanotwins

Shuyou Li, T. Barbee, Yuntian Zhu, 2011 .

Detwinning, damage and crack initiation during cyclic loading of Cu samples containing aligned nanotwins

J. Weertman, Shuyou Li, T. Barbee, 2011 .

Microstructural stability during cyclic loading of multilayer copper/copper samples with nanoscale twinning

J. Weertman, T. Barbee, B. Myers, 2009 .

Strain gradients in Al-2% Cu thin films

J. Cohen, C. Shute, 1991 .

Detwinning and Crack Initiation During Cyclic Loading in Multilayer Copper/Copper Samples with Nanoscale Twinning

J. Weertman, T. Barbee, B. Myers, 2009 .

Twin stability in highly nanotwinned Cu under compression, torsion and tension

J. Weertman, T. Barbee, Yuntian Zhu, 2012 .

Residual Stress Analysis of Al Alloy Thin Films by X-Ray Diffraction as a Function of Film Thickness

J. Cohen, C. Shute, D. A. Jeannottea, 1988 .