Sandeep Menon

Modeling the Rate-Dependent Durability of Reduced-Ag SAC Interconnects for Area Array Packages Under Torsion Loads

M. Pecht, M. Osterman, V. Srinivas, 2013, Journal of Electronic Materials.

Evaluating the Impact of Dwell Time on Solder Interconnect Durability Under Bending Loads

M. Pecht, M. Osterman, Sandeep Menon, 2015, Journal of Electronic Materials.

Effect of ENEPIG Surface Finish on the Vibration Reliability of Solder Interconnects

M. Pecht, M. Osterman, A. Pearl, 2013 .

Copper Trace Fatigue Life Modeling for Rigid Electronic Assemblies

M. Pecht, M. Osterman, Sandeep Menon, 2021, IEEE Transactions on Device and Materials Reliability.

AN ANALYTICAL APPROACH FOR FATIGUE LIFE ESTIMATION OF COPPER TRACES FOR DESIGN OPTIMIZATION IN ELECTRONIC ASSEMBLIES

Sandeep Menon, Sandeep Menon, 2015 .

High lead solder (over 85 %) solder in the electronics industry: RoHS exemptions and alternatives

Michael Osterman, Michael Pecht, Elviz George, 2015, Journal of Materials Science: Materials in Electronics.

Anomaly detection of non punch through insulated gate bipolar transistors (IGBT) by robust covariance estimation techniques

Michael Pecht, Nishad Patil, Diganta Das, 2010, 2010 2nd International Conference on Reliability, Safety and Hazard - Risk-Based Technologies and Physics-of-Failure Methods (ICRESH).

Evaluating covariance in prognostic and system health management applications

Tommy W. S. Chow, Michael Pecht, Xiaohang Jin, 2015 .