Francis Rivai

Cross-sectional nanoprobing sample preparation on sub-micron device with fast laser grooving technique

Ran He, Hao Tan, Pik Kee Tan, 2018, Microelectronics and reliability.

サブミクロン素子の断面ナノプロービング故障分離技術【Powered by NICT】

Francis Rivai, P K Tan, H H Yap, 2016 .

Application of Scanning Capacitance Microscopy on SOI device with wafer edge low yield pattern

C. Q. Chen, Francis Rivai, G. B. Ang, 2017, Microelectron. Reliab..

Application of Fast Laser Deprocessing Techniques on large cross-sectional view area sample with FIB-SEM dual beam system

L. Zhu, Ran He, Hao Tan, 2016, Microelectron. Reliab..

FIB‐SEM二重ビームシステムを用いた大規模横断展望面積試料上での高速レーザ除去法の応用【Powered by NICT】

Francis Rivai, P K Tan, C Q Chen, 2016 .

Electrical analysis on implantation-related defect by nanoprobing methodology

Jeffrey Lam, C. Q. Chen, Francis Rivai, 2016, Microelectron. Reliab..

Nanoprobing on the SRAM static noise margin (SNM) soft fail analysis

C. Q. Chen, Francis Rivai, Z. H. Mai, 2016, 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Embed SRAM IDDOFF fail root cause identification by combination of device analysis and localized circuit analysis

C. Q. Chen, Francis Rivai, G. B. Ang, 2017, Microelectron. Reliab..

Fault isolation on the wafer with lithography hotspot signature

C. Q. Chen, J. Lam, Francis Rivai, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Cross-sectional nanoprobing fault isolation technique on submicron devices

L. Zhu, Ran He, Y. Z. Zhao, 2016, Microelectron. Reliab..