M. Damayanti

发表

Study of ruthenium-based barrier layer for copper metallization

M. Damayanti, 2009 .

Microstructural Evolution of Annealed Ruthenium–Nitrogen Films

A. V. Vairagar, T. Sritharan, H. Engelmann, 2007 .

Effect of porosity and adhesion promoter layer on adhesion energy of nanoporous inorganic low-κ

T. Sritharan, S. Mhaisalkar, H. Tan, 2006 .

Effects of ternary alloying on mechano-synthesis and nano-crystal stability of an iron-silicon alloy

T. Sritharan, B. Zuo, M. Damayanti, 2005 .

Adhesion study of tetra methyl cyclo tetra siloxanes (TMCTS) and tri methyl silane (3MS)-based low-k films

T. Sritharan, S. Mhaisalkar, K. Zeng, 2005 .

Erratum to "Adhesion study of low-k/Si system using 4-point bending and nanoscratch test" (Mater. Sci. Eng. B 121 (3) (2005) 193-198)

T. Sritharan, S. Mhaisalkar, K. Zeng, 2005 .

Effect of electron beam treatment on adhesion of Ta/polymeric low-k interface

S. Mhaisalkar, Zhong Chen, Sam Zhang, 2006 .

Study of Ru barrier failure in the Cu/Ru/Si system

T. Sritharan, S. Mhaisalkar, L. Chan, 2007 .

Ruthenium barrier/seed layer for Cu/low-κ metallization : Crystallographic texture, roughness, diffusion, and adhesion

T. Sritharan, S. Mhaisalkar, L. Chan, 2006 .

Effects of dissolved nitrogen in improving barrier properties of ruthenium

S. G. Mhaisalkar, T. Sritharan, S. Mhaisalkar, 2006 .