X. Avale

ECD seed copper layer for seed enhancement in advanced interconnects

P. Haumesser, G. Passemard, T. Ritzdorf, 2003 .

Copper post-electroplating anneal: evaluation of in-line vs. furnace anneal on layer properties

S. Maitrejean, P. Haumesser, T. Mourier, 2003 .

Electroless deposition of CoWP: Material characterization and process optimization on 300mm wafers

A. Roule, P. Haumesser, G. Passemard, 2006 .