X. Zhao

Advanced scanning acoustic technique application in flip-chip devices

J. Chin, X. Hu, M. Tay, 2011, 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

The effect of polyimide surface treatment on flip-chip assembly

J. Chin, X. Zhao, Michael Su, 2009, 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Lid adhesive failure study for flip chip packaging

J. Chin, R. Master, X. Zhao, 2008, 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits.