A. Ciccomancini Scogna

Broadband signal integrity characterization of a high speed differential backplane pair

A. Ciccomancini Scogna, F. Zanella, 2006, 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006..

Signal integrity analysis of single-ended and differential signaling in PCBs with EBG structure

V. Ricchiuti, A. Orlandi, A. Ciccomancini Scogna, 2008, 2008 IEEE International Symposium on Electromagnetic Compatibility.

Design and optimization of LTCC digital demodulator used for aerospace satellite applications

A. Ciccomancini Scogna, F. Zanella, 2006, 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006..

Electromagnetic simulation of 3D stacked ICs: Full model vs. S-parameter cascaded based model

A. Orlandi, M. Swaminathan, F. de Paulis, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Analysis of return path discontinuities in multilayer PCBs and their impact on the signal and power integrity

E. Bogatin, A. Ciccomancini Scogna, 2010, 2010 IEEE International Symposium on Electromagnetic Compatibility.