D. Schneider

Evaluation of insulation material in advanced high power IGBT modules with extended operation temperature

S. Hartmann, L. Feller, D. Schneider, 2010, 2010 6th International Conference on Integrated Power Electronics Systems.

Lifetime analysis of solder joints in high power IGBT modules for increasing the reliability for operation at 150 degreeC

D. Schneider, L. Feller, S. Hartmann, 2008, Microelectron. Reliab..

The influence of humidity on the high voltage blocking reliability of power IGBT modules and means of protection

Munaf Rahimo, Arnost Kopta, Daniel Schneider, 2018, Microelectron. Reliab..

On the operation of a press pack IGBT module under short circuit conditions

D. Schneider, S. Gunturi, D. Schneider, 2006, IEEE Transactions on Advanced Packaging.

4.5kV press pack IGBT designed for ruggedness and reliability

U. Schlapbach, M. Rahimo, A. Kopta, 2004, Conference Record of the 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting..

Performance-enhancing packaging Designing an IGBT module packaging for high-quality and reliable operation

S. Hartmann, L. Feller, D. Schneider, 2008 .

packagingan IGBT module packaging for high-quality and reliable operation

Samuel Hartmann, Daniel Schneider, Lydia Feller, 2008 .