P. Alpern
发表
P. Leiderer,
Thomas Benda,
P. Alpern,
1981
.
R. Tilgner,
P. Alpern,
O. Selig,
1995
.
P. Leiderer,
Thomas Benda,
P. Alpern,
1982
.
Rainer Tilgner,
P. Alpern,
R. Schmidt,
2005
.
P. Alpern,
G. Menzel,
R. Tinlgner,
1986,
IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.
K. Müller,
R. Tilgner,
P. Alpern,
1992
.
Bernd Michel,
Rainer Dudek,
C. Birzer,
1998,
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
Rainer Dudek,
Rainer Tilgner,
P. Alpern,
2002
.
B. Michel,
R. Dudek,
H. Walter,
2001,
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
J. Baumann,
R. Tilgner,
P. Alpern,
1994
.
R. Tilgner,
P. Alpern,
O. Selig,
1992,
1992 Proceedings 42nd Electronic Components & Technology Conference.
Peter Alpern,
Kheng Chooi Lee,
A. Vythilingam,
2005,
Microelectron. Reliab..
M. Stecher,
J. Wilde,
T. Smorodin,
2008,
IEEE Transactions on Device and Materials Reliability.
M. Stecher,
J. März,
C. Bohm,
2006
.
M. Stecher,
P. Alpern,
H. Gunther,
2009,
IEEE Transactions on Device and Materials Reliability.
On the Way to Zero Defect of Plastic-Encapsulated Electronic Power Devices—Part II: Molding Compound
M. Stecher,
A. Kessler,
R. Tilgner,
2009,
IEEE Transactions on Device and Materials Reliability.
P. Leiderer,
Thomas Benda,
P. Alpern,
1982
.
Ronald Kakoschke,
P. Alpern,
Stefan Dipl.-Phys. Wurm,
1988
.
Rainer Dudek,
Rainer Tilgner,
Kheng Chooi Lee,
2002
.
M. Stecher,
P. Alpern,
H. Gunther,
2009,
IEEE Transactions on Device and Materials Reliability.
P. Alpern,
S. Wurm,
1989
.
P. Alpern,
R. Kakoschke,
S. Wurm,
1988
.
P. Alpern,
R. Kakoschke,
W. Bergholz,
1989
.
M. Stecher,
M. Pfost,
T. Smorodin,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
R. Tilgner,
P. Alpern,
O. Selig,
1992
.