K. Sekiya

Thermal damage of silicon wafer in thermal cleaving process with pulsed laser and CW laser

Yasuo Yamane, Takashi Ueda, Keiji Yamada, 2006, SPIE LASE.

Study of 10G/40G Hybrid Ultra Long Haul Transmission Systems with Reconfigurable OADMs for Efficient Wavelength Usage

T. Ito, T. Ono, K. Sekiya, 2002, 2002 28TH European Conference on Optical Communication.

The influence of cutting edge sharpness on surface finish in facing with round nosed cutting tools

K. Sekiya, D. Dornfeld, D. Dornfeld, 2008 .