I. Maus

发表

B. Michel, B. Wunderle, I. Maus, 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Michel, B. Wunderle, D. May, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel, B. Wunderle, K. Jansen, 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
B. Michel, B. Wunderle, R. Pantou, 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
B. Wunderle, L. Ernst, I. Paul, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
D. Vu, I. Maus, H. Nabi, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel, D. Vogel, I. Maus, 2010, 3rd Electronics System Integration Technology Conference ESTC.
B. Wunderle, B. Michel, J. Keller, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
B. Wunderle, B. Michel, J. Keller, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
B. Wunderle, B. Michel, H. Pape, 2010, 3rd Electronics System Integration Technology Conference ESTC.
B. Wunderle, L. J. Ernst, H. Pape, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
B. Wunderle, L. Ernst, I. Maus, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.
B. Michel, B. Wunderle, L. Ernst, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.