M. Lehr

Crack and damage evaluation in low-k BEoL stacks under assembly and CPI aspects

B. Michel, J. Auersperg, D. Vogel, 2010, 3rd Electronics System Integration Technology Conference ESTC.

CPI assessment using a novel characterization technique based on bump-assisted scratch-indentation testing

H. Engelmann, H. Geisler, M. Lehr, 2011, 2011 IEEE International Interconnect Technology Conference.

Copper-dielectric cap interface with enhanced reliability for 45nm technology and beyond

Frank Feustel, Oliver Aubel, Ulrich Mayer, 2010 .

Profiling of the Mechanical Properties of Ultralow- k Films Using Nanoindentation Techniques

H. Engelmann, H. Geisler, M. Lehr, 2011 .

Crack propagation and delamination analysis within the die by camera-assisted double cantilever beam technique

M. Hecker, M. Lehr, R. Hentschel, 2011, 2011 IEEE International Interconnect Technology Conference.

Crack and delamination Risk Evaluation in low-k BEol

B. Michel, J. Auersperg, D. Vogel, 2013 .

Crack and Damage Evaluation in low-k Interconnect Structuresunder Chip Package Interaction Aspects

B. Michel, J. Auersperg, D. Vogel, 2013, CP 2013.

Crack and damage evaluation in low-k BEoL structures under CPI aspects

B. Michel, J. Auersperg, D. Vogel, 2009, Electronic Packaging Technology Conference.

Crack and damage evaluation in low-k BEoL stacks under chip package interaction aspects

B. Michel, J. Auersperg, D. Vogel, 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Multi-Scale Mechanical Probing Techniques To Investigate The Stability Of BEOL Layer Stacks With Sub-100 nm Structures

H. Engelmann, H. Geisler, M. Lehr, 2011 .

Adhesion analysis for on-chip interconnect structures by beam bending techniques with optical crack length determination

Dirk Breuer, Michael Hecker, M. Hecker, 2013 .

Crack and damage in low-k BEoL stacks under assembly and CPI aspects

B. Michel, D. Vogel, J. Auersperg, 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).

Fracture Toughness Assessment of Patterned Cu-Interconnect Stacks by Dual-Cantilever-Beam (DCB) Technique

E. Zschech, E. Zschech, M.U. Lehr, 2009, IEEE Transactions on Semiconductor Manufacturing.