C. Hof

Polymer Materials Characterization, Modeling and Application

Daoguo Yang, K. Jansen, Guoqi Zhang, 2007 .

Mechanical characterization and modeling of curing thermosets

C. Hof, 2006 .

Investigation on flip chip solder joint fatigue with cure-dependent underfill properties

J. Caers, Daoguo Yang, Guoqi Zhang, 2003 .

Vertical die crack stresses of Flip Chip induced in major package assembly processes

M. S. Kiasat, Leo J. Ernst, Daoguo Yang, 2000 .

Mechanical Modeling and Characterization of the Curing Process of Underfill Materials

J.F.J.M. Caers, M. S. Kiasat, Leo J. Ernst, 2002 .

Durability of laser fibers

F. Debruyne, F. M. J. Debruyne, E. te Slaa, 2004, World Journal of Urology.

Novel shear tools for viscoelastic characterization of packaging polymers

G. Q. Zhang, Kaspar M. B. Jansen, Dao-Guo Yang, 2007, Microelectron. Reliab..