R. McGouey

A study of the chemical and physical interaction between copper and polyimide

N. Klymko, D. Shih, Chih-Chao Yang, 1989 .

Comparison of vapor and liquid phase silylation processes of photoresists

M. Brady, J. Gelorme, J. Paraszczak, 1991 .

Fabrication of contiguous-disk magnetic bubble devices

A. Gangulee, K. Ahn, R. Kobliska, 1980 .

Adhesion properties of a structural etch stop material for use in multilayer electronic wiring structures

J. Hedrick, J. Labadie, W. Volksen, 1995 .

The use of organosilicon polymers in multilayer plasma resist processing

M. Hatzakis, J. Heidenreich, J. Paraszczak, 1987 .

Factors affecting the interconnection resistance and yield in multilayer polyimide/copper structures

A. Deutsch, L. Rothman, D. Shih, 1993 .

Factors affecting the interconnection resistance and yield in the fabrication of multilayer polyimide/metal thin film structures

Alina Deutsch, John J. Ritsko, Chandrasekhar Narayan, 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.

Fabrication and performance studies of multilayer polymer/metal interconnect structures for packaging applications

Donald C. Hofer, Gerard V. Kopcsay, Alina Deutsch, 1991, 1991 Proceedings 41st Electronic Components & Technology Conference.

High-Speed Signal Propagation on Lossy Transmission Lines

Gerard V. Kopcsay, J. S. Wilczynski, Alina Deutsch, 1990, IBM J. Res. Dev..

The effect of solvent absorption on the electrical and dielectric properties of polyimide films

D. Shih, J. Paraszczak, S. Nunes, 1990 .