Tomotake Tohei

Effect of Thermal Cycle Conditions on Thermal Fatigue Life of Chip Size Package Solder Joint

I. Shohji, Tomotake Tohei, K. Yoshizawa, 2008 .

Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package with Underfill

I. Shohji, Tomotake Tohei, K. Yoshizawa, 2008 .

Bondability of Si-Ge thermoelectric element and molybdenum electrode using aluminum for thermoelectric module

Tomotake Tohei, S. Fujiwara, T. Jinushi, 2012, 2012 4th Electronic System-Integration Technology Conference.

Bondability of Mg2Si element to Ni electrode using Al for thermoelectric modules

Tomotake Tohei, S. Fujiwara, T. Jinushi, 2014 .

Heat dissipative Pb-free bonding technology using Al-rich Zn/Al/Zn clad solder

A. Hirose, Tomotake Tohei, Y. Oda, 2017 .