Z.-S. Choi

发表

Activation energy and prefactor for surface electromigration and void drift in Cu interconnects

Carl V. Thompson, Reiner Mönig, C. Thompson, 2007 .

Void dynamics in copper-based interconnects

C. Thompson, C. Gan, M. Lim, 2011 .

Kinetics of Void Drift in Copper Interconnects

C. Thompson, R. Mönig, Z.-S. Choi, 2006 .

Mechanical Degradation of LiMn1.95Al0.05O4 electrodes

D. Kramer, R. Mönig, Z.-S. Choi, 2013 .

Effects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects

Carl V. Thompson, Reiner Mönig, C. Thompson, 2008 .

Effect of pre-existing void in sub-30nm Cu interconnect reliability

Joo-Tae Moon, J. Moon, Siyoung Choi, 2010, 2010 IEEE International Reliability Physics Symposium.

Dependence of the electromigration flux on the crystallographic orientations of different grains in polycrystalline copper interconnects

Carl V. Thompson, Reiner Mönig, C. Thompson, 2007 .

Correlation of stress and structural evolution in Li4Ti5O12-based electrodes for lithium ion batteries

Reiner Mönig, D. Kramer, R. Mönig, 2013 .

A Reflection on Sustainable Anode Materials for Electrochemical Chloride Oxidation

Ki Tae Nam, H. Randriamahazaka, W. Choi, 2023, Advances in Materials.

Voltage Ramp and Time-Dependent Dielectric Breakdown in Ultra-Narrow Cu/SiO2 Interconnects

H. Park, J. Bae, G. Choi, 2008, 2008 International Interconnect Technology Conference.