D. Wargulski

发表

B. Wunderle, D. May, D. Wargulski, 2017, 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

D. Abou‐Ras, D. Friedrich, H. Hempel, 2023, Advanced Functional Materials.

E. Auerswald, J. Rudzki, D. Wargulski, 2019, 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).

A. Ziaei, B. Wunderle, D. May, 2020, 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

B. Wunderle, D. May, D. Wargulski, 2019, 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

B. Wunderle, D. May, D. Wargulski, 2020, 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).

A. Ziaei, B. Wunderle, D. May, 2018, 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

B. Wunderle, D. May, R. Schacht, 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

B. Wunderle, D. May, R. Schacht, 2020, 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).