C. Lau
发表
Y. T. Chin,
K. S. Tan,
T. Tou,
2021
.
Y. T. Chin,
K. S. Tan,
T. Tou,
2019,
Composites Part B: Engineering.
Chun-Sean Lau,
M. Z. Abdullah,
F. C. Ani,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Mohd Zulkifly Abdullah,
Chun-Sean Lau,
F. Che Ani,
2012
.
C. Y. Khor,
Chun Sean Lau,
D. Soares,
2016
.
K. Y. Li,
P. Shum,
B. Shi,
2010
.
Mohd Zulkifly Abdullah,
C. Y. Khor,
Chun-Sean Lau,
2014,
Microelectron. Reliab..
F. Macedo,
M. Cerqueira,
D. Soares,
2018,
Journal of Materials Engineering and Performance.
F. Macedo,
M. Cerqueira,
D. Soares,
2015,
Journal of Materials Science: Materials in Electronics.
Ning Ye,
Chun-Sean Lau,
Yi Chun Tan,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Mohd Zulkifly Abdullah,
Chun-Sean Lau,
F. Che Ani,
2012,
Microelectron. Reliab..
Chun-Sean Lau,
Ning Ye,
Hem Takiar,
2018,
2018 IEEE CPMT Symposium Japan (ICSJ).