D. Amir

IMPACT OF LOW SILVER SOLDER PASTES ON AREA ARRAY SOLDER JOINT QUALITY

L. May, S. Aravamudhan, S. Mokler, 2013 .

Validation of warpage limit for successful component surface mount (SMT)

S. Cho, S. Cho, D. Amir, 2008, 2008 58th Electronic Components and Technology Conference.

Impact of processing conditions and solder materials on surface mount assembly defects

R. Sidhu, R. Aspandiar, D. Amir, 2011 .

Solder Joint Reliability Improvement Using the Cold Ball Pull Metrology

G. Raiser, D. Amir, 2005 .

CAVITY BOARD SMT ASSEMBLY CHALLENGES

D. Amir, B. Grossman, 2018 .

HEAD – AND – PILLOW SMT FAILURE MODES

R. Aspandiar, D. Amir, P. Gill, 2009 .