G. Fresquet

Metrology and Inspection

J. Piel, M. Feser, H. Takizawa, 2015 .

Analysis and Modeling of In Situ Boron‐Doped Polysilicon Deposition by LPCVD

J. Couderc, G. Fresquet, C. Azzaro, 1995 .

Control of 3D IC process steps by optical metrologies

D. B. Cunff, G. Fresquet, Th. Raymond, 2015 .

Uniformity Control of 3-D Stacked ICs: Optical Metrology and Statistical Analysis

D.K. de Vries, D. Le Cunff, G. Fresquet, 2015, IEEE Transactions on Semiconductor Manufacturing.

Use of optical metrology techniques for uniformity Control of 3D stacked IC's

P. Bar, D. Le Cunff, M. Tardif, 2014, 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014).

A versatile optical system for metrology and defects inspection of 3D integration processes

A. Bosseboeuf, S. Petitgrand, P. Coste, 2012, 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration.

Optical Characterization and Defect inspection for 3D stacked IC technology

Gilles Fresquet, Jean-Philippe Piel, J. Piel, 2014 .