Chandrasekharan Nair
发表
Rao Tummala,
Chandrasekharan Nair,
Venky Sundaram,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Fuhan Liu,
Chandrasekharan Nair,
Rao R. Tummala,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Fuhan Liu,
Chandrasekharan Nair,
Venky Sundaram,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Fuhan Liu,
Bartlet DeProspo,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Chandrasekharan Nair,
V. Chandran,
2011
.
V. Sundaram,
Fuhan Liu,
R. Tummala,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Chandrasekharan Nair,
Vidya Jayaram,
Karan R. Bhangaonkar,
2023,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Rao Tummala,
Chandrasekharan Nair,
P. Markondeya Raj,
2018,
IEEE Nanotechnology Magazine.
Fuhan Liu,
Chandrasekharan Nair,
Rao R. Tummala,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Chandrasekharan Nair,
Venky Sundaram,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
Fuhan Liu,
R. Tummala,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Chandrasekharan Nair,
Venky Sundaram,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
Fuhan Liu,
R. Tummala,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Fuhan Liu,
Bartlet DeProspo,
Chandrasekharan Nair,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).