Sashi S. Kandanur

In-Situ Investigation of Organic Additive Interactions in Copper Electroplating Solutions with Surface Enhanced Raman Spectroscopy (SERS)

Sajanlal R. Panikkanvalappil, R. Tummala, H. Sharma, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Coupled Effect of Filler Content and Countersurface Roughness on PTFE Nanocomposite Wear Resistance

L. Schadler, T. Blanchet, Sashi S. Kandanur, 2010 .

Effect of Activated Carbon and Various Other Nanoparticle Fillers on PTFE Wear

T. Blanchet, Sashi S. Kandanur, S. Bhargava, 2014 .

Suppression of wear in graphene polymer composites

N. Koratkar, M. Rafiee, Zhongzhen Yu, 2012 .

Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior

V. Sundaram, R. Tummala, H. Sharma, 2018, Journal of Electronic Materials.