C. Cregut

3D frequency-dependent RLC elements extraction by full wave analysis: identification of the return current paths in complex power and ground grids of high speed VLSI circuits

T. Le Gouguec, F. Huret, Y. Quere, 2005, Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005..

Demonstration of an extendable and industrial 300mm BEOL integration for the 65-nm technology node

D. Reber, A. Farcy, C. Cregut, 2004, IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004..

Models for pre-layout inductance estimation including frequency effects on current return path in advanced digital circuits

F. Huret, C. Cregut, L. David, 2005, IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005..

Return Path Assumption Validation for Inductance Modeling in Digital Design

Y. Quere, L. David, C. Cregut, 2007, IEEE Transactions on Advanced Packaging.

Return Path Assumption Validation for Inductance Modeling in Digital Design

L. David, C. Cregut, F. Nyer, 2007 .

Low-k dielectrics influence on crosstalk: electromagnetic analysis and characterization

J. Chilo, C. Cregut, G. Le Carval, 1998, Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102).

Manufacturability and Speed Performance Demonstration of Porous ULK (k=2.5) for a 45nm CMOS Platform

M. Haond, P. Ferreira, C. Cregut, 2007, 2007 IEEE Symposium on VLSI Technology.