P. Arulvanan

Effects of Four Key Process Variables on Size Shrinkages of Low Temperature Co-Fired Ceramic Substrates

Z. Zhong, P. Arulvanan, C. K. Goh, 2007 .

Assembly and reliability of PBGA packages on FR-4 PCBs with SnAgCu solder

Zhaowei Zhong, Z. Zhong, P. Arulvanan, 2006 .

Characterization of SnAgCu and SnPb solder joints on low‐temperature co‐fired ceramic substrate

H. P. Maw, Z. Zhong, P. Arulvanan, 2007 .

Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints

Periannan Arulvanan, Zhaowei Zhong, Xunqing Shi, 2006, Microelectron. Reliab..

Effects of Key Process Conditions on Warpage and Via Protrusion of LTCC Substrate

P. Arulvanan, C. K. Goh, Z. Zhong, 2008 .

Lead‐free PCB assembly and effects of process conditions on the profile and reliability of solder joints

Z. Zhong, X. Shi, P. Arulvanan, 2005 .

Effects of Sintering Process Conditions on Size Shrinkages of Low-Temperature Co-Fired Ceramic Substrate

Zhaowei Zhong, P. Arulvanan, C. F. Ang, 2006 .

Thermal Performance Evaluation of Power SSL Module in LTCC

A. Lu, P. Arulvanan, P. Shi, 2007, 2007 9th Electronics Packaging Technology Conference.