H. Dong

Reliability of wafer-level SLID bonds for MEMS encapsulation

M. Paulasto-Krockel, V. Vuorinen, T. Suni, 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC).

Microstructure and Mechanical Property of Aluminum / Copper Dissimilar Friction Welded Joints Sound aluminum / copper dissimilar joints can be produced with continuous drive friction welding after a 2 h postweld heat treatment at 100

Y. L., H. Dong, BY S. J. Chen, 2017 .

Numerical simulation of heat transfer and fluid flow in a double-sided gas-tungsten arc welding process

H Dong, H Gao, L Wu, 2003 .

WELDING RESEARCH

S. Kou, H. Cao, Y. K. Yang, 2004 .

Analysis of microstructural evolution in SLID-bonding used for hermetic encapsulation of MEMS devices

T. Laurila, M. Paulasto-Krockel, V. Vuorinen, 2012, 2012 4th Electronic System-Integration Technology Conference.

Liquation Tendency and Liquid-Film Formation in Friction Stir Spot Welding

S. Kou, Y. K. Yang, H. Dong, 2008 .

Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures

M. Paulasto-Kröckel, V. Vuorinen, G. Ross, 2020, Journal of Electronic Materials.

Liquation of Mg Alloys in Friction Stir Spot Welding

Sindo Kou, S. Kou, H. Cao, 2008 .