A. Unger
发表
Walter Sextro,
Simon Althoff,
Tobias Meyer,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
W. Sextro,
M. Brökelmann,
T. Meyer,
2018,
International Symposium on Microelectronics.
W. Sextro,
M. Brökelmann,
Reinhard Schemmel,
2018
.
W. Sextro,
T. Meyer,
K. Guth,
2014
.
Walter Sextro,
Simon Althoff,
Andreas Unger,
2017
.
W. Sextro,
T. Meyer,
A. Unger,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
O. Grydin,
M. Schaper,
F. Hengsbach,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
M. Brökelmann,
D. Siepe,
M. Hunstig,
2020
.
M. Brökelmann,
M. Hunstig,
A. Unger,
2019,
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Börje Sellergren,
Claudia Sulitzky,
B. Sellergren,
2002
.
T. Strothotte,
Thomas Vogel,
A. Unger,
2006
.
Y. Lim,
R. V. Padilla,
R. Barraza,
2021
.
W. Sextro,
K. Guth,
M. Hunstig,
2016,
2016 IEEE CPMT Symposium Japan (ICSJ).
Walter Sextro,
Simon Althoff,
Tobias Meyer,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Walter Sextro,
Simon Althoff,
Daniel Bolowski,
2014
.
W. Sextro,
A. Unger,
Simon Althoff,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).