K. Liu

A comparison of polymers and solder alloys by reliability tests on multi-layer redistribution lines in Fan Out Wafer Level Package

N. Kao, Hong-da Chang, Jay Hsiao, 2016, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

Disadvantages of Control Chart in Printing Quality Control over Solder Paste and Strategies for Improvement

Chen Peng, Xiaohui Gu, Kenny Liu, 2010 .