M. Nishimura
发表
Masaya Toba,
Yutaka Nomura,
M. Nishimura,
2015,
2015 IEEE CPMT Symposium Japan (ICSJ).
D. Akai,
M. Ishida,
N. Okada,
2014,
2014 IEEE International Ultrasonics Symposium.
T. Sega,
H. Katagiri,
M. Nishimura,
1997,
Proceedings of Power Conversion Conference - PCC '97.
T. Ishiguro,
M. Nishimura,
2003
.
T. Terasaki,
T. Morita,
Y. Yasuda,
2018,
IEEE Transactions on Device and Materials Reliability.
T. Ishiguro,
T. Yamazaki,
M. Nishimura,
2002
.
T. Terasaki,
T. Morita,
Y. Yasuda,
2016,
2016 International Conference on Electronics Packaging (ICEP).
Effect of Manufacturing Process on Micro-Deformation Behavior of Sintered-Silver Die-Attach Material
T. Terasaki,
M. Nishimura,
Tomohisa Suzuki,
2016,
IEEE Transactions on Device and Materials Reliability.
T. Terasaki,
T. Matsuda,
T. Morita,
2019,
IEEE Transactions on Device and Materials Reliability.
T. Terasaki,
T. Morita,
Y. Yasuda,
2018,
IEEE Transactions on Device and Materials Reliability.
Y. Baba,
A. Yoshida,
T. Yamaguchi,
1991
.
H. Okamoto,
A. Masuda,
T. Itoh,
2006
.
T. Ishiguro,
M. Nishimura,
2002
.