G. Wyborn

Damascene test structures for the evaluation of barrier layer performance against copper diffusion

J. Torres, P. Motte, M. Swaanen, 2001 .

Full Copper Electrochemical Mechanical Planarization (Ecmp) as a Technology Enabler for the 45 and 32nm Nodes

M. C. Luche, M. Rivoire, M. Mellier, 2007, 2007 IEEE International Interconnect Technology Conferencee.

Observation of Negative Group Velocity Rotons in Liquid Helium

G. Wyborn, A. Wyatt, 1987 .