R. Cao

Mitigation of whisker growth by improving the creep properties of Sn coating with bismuth

Zhengming Sun, F. Xue, Jian Zhou, 2021, Journal of Materials Science.

A comparative study on the growth behaviors of Sn whiskers and hillocks in a Sn-Al alloy coating under different environments

Zhengming Sun, F. Xue, Jian Zhou, 2021 .

Mechanical Properties and Degradation Behaviors of Zn-xMg Alloy Fine Wires for Biomedical Applications

J. Bai, F. Xue, Q. Fan, 2021, Scanning.

Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn–0.7Cu solder joints

F. Xue, Jian Zhou, Saipeng Li, 2017, Journal of Materials Science: Materials in Electronics.

Diameter-dependent in vitro performance of biodegradable pure zinc wires for suture application

Yufeng Zheng, J. Bai, F. Xue, 2019, Journal of Materials Science & Technology.

Microstructure, interfacial reactions and mechanical properties of Co/Sn/Co and Cu/Sn/Cu joints produced by transient liquid phase bonding

F. Xue, Jian Zhou, Fengjiang Wang, 2018, Journal of Materials Science: Materials in Electronics.

Microstructure and mechanical properties of resistor chip joints fabricated by laser soldering using Sn-58Bi solder on Ni(P)/Cu pads

F. Xue, Jian Zhou, Saipeng Li, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Effect of interfacial intermetallic compounds morphology on mechanical properties of solder joint with finite element simulation

F. Xue, Jian Zhou, Shuang Tian, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).