G. Lau

Compatibility of Dielectric Passivation and Temporary Bonding Materials for Thin Wafer Handling in 3-D TSV Integration

Shan Gao, Jaesik Lee, Y. Yeo, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Ultra-high selectivity TSV etching hardmask process development and integration for 3D-SIC

Gao Shan, Hong Yu Li, J. Rantala, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Through silicon via (TSV) scallop smoothening technique

K. Chui, Goon Heng Wong, King Jien Chui, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Demonstration of OSAT compatible 300 mm through Si interposer

G. Lo, L. Ding, G. Lau, 2013, 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).

Fabrication of a rotary micromirror for fiber-optic switching

Min Hu, Hejun Du, Shih-Fu Ling, 2005 .