R. Springer

发表

Defl ection Unit for MultiBeam Mask Making

Klingler, F. Letzkus, C. Klein, 2022 .

Ion projection direct structuring for patterning of magnetic media

Elmar Platzgummer, Hans Loeschner, Andreas Dietzel, 2002 .

TSI Process Using Vapor-Applied Crosslinking Silylating Agents for Realizing sub-Quarter Micron Resolution.

W. Peterson, B. Höfflinger, M. Irmscher, 1996 .

Boron-content dependence of Fano resonances in p-type silicon

R. Gajić, F. Kuchar, F. Letzkus, 2003 .

Progress in placement control for ion beam stencil mask technology

Joerg Butschke, Thomas Struck, Ernst Haugeneder, 2001, SPIE Advanced Lithography.

Comparison of silicon stencil mask distortion measurements with finite element analysis

Roxann L. Engelstad, Edward G. Lovell, Joerg Butschke, 1999 .

Directly sputtered stress-compensated carbon protective layer for silicon stencil masks

Joerg Butschke, Albrecht Ehrmann, Rainer Kaesmaier, 1999 .

SOI wafer flow process for stencil mask fabrication

Mathias Irmscher, Albrecht Ehrmann, Hans Loschner, 1999 .

Stencil mask technology for ion beam lithography

Hans Loeschner, Ivo W. Rangelow, Joerg Butschke, 1998, Photomask Technology.

Ion Projection Lithography (IPL): posters presented at the 5th Intl. SEMATECH Next Generation Lithography (NGL) Workshop, Pasadena, California, USA, 28-30 Aug 2001

H. Loeschner, R. Springer, G. Stengl, 2002 .

Dry etch improvements in the SOI wafer flow process for IPL stencil mask fabrication

Mathias Irmscher, Albrecht Ehrmann, Reinhard Springer, 2000 .