H. Chuang

Critical new issues relating to interfacial reactions arising from low solder volume in 3D IC packaging

Y. Lai, W. Shih, C. Kao, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Critical Concerns in Soldering Reactions Arising from Space Confinement in 3-D IC Packages

Y. J. Chen, J. J. Yu, C. C. Li, 2012, IEEE Transactions on Device and Materials Reliability.

Effect of Ambient Salinity on Growth, Survival Rate, and Feed Efficiency in the Early Stages of Puffer Fish Takifugu rubripes*1,2

Kyung-Nam Han, C. Kitajima, S. Matsui, 2007 .

Aligned short-fibre reinforced thermosets: Experiments and analysis lend little support for established theory

M. Piggott, M. Ko, H. Chuang, 1993 .

Electromigration in flip chip solder joints under extra high current density

Yi-Shao Lai, J. H. Ke, Y. Lai, 2010 .

Soldering reactions under space confinement for 3D IC applications

Y. J. Chen, J. J. Yu, C. C. Li, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.