Jifeng Mao

Effect of substrate resistivity on switching noise in on-chip power distribution networks

Jifeng Mao, M. Swaminathan, J. Libous, 2003, Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710).

Computation and effect of field penetration through planes in multi-layered package power distribution networks for giga-processors

Madhavan Swaminathan, Jifeng Mao, J. Srinivasan, 2000, IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524).

Modeling of field penetration through planes in multilayered packages

Madhavan Swaminathan, Jinseong Choi, Jifeng Mao, 2001 .

Coupled Analysis of Quasi-static and Full-Wave Solution towards IC, Package and Board Co-design

S. Wane, Jifeng Mao, An-Yu Kuo, 2007, 2007 IEEE Electrical Performance of Electronic Packaging.

Modeling of Simultaneous Switching Noise in On-Chip and Package Power Distribution Networks Using ConformalMapping, Finite Difference Time Domain and Cavity Resonator Methods

Jifeng Mao, 2004 .

Electromagnetic modelling of switching noise in on-chip power distribution networks

Woopoung Kim, M. Swaminathan, Jifeng Mao, 2003, 8th International Conference on Electromagnetic Interference and Compatibility.