S. Hirsch

发表

Integration of Ba1−xSrxTiO3-based active thin films with silicon-compatible materials and process science protocols to enable affordable on-the-move communications technologies

J. Demaree, M. Cole, W. Nothwang, 2005 .

INTEGRATION OF ACTIVE THIN FILMS WITH SILICON COMPATIBLE MATERIALS AND PROCESS SCIENCE PROTOCOLS FOR MEMS SCALE VIBRATION DAMPING APPLICATIONS

G. Carman, J. Demaree, M. Cole, 2005 .

An Elegant Post-Growth Process Science Protocol to Improve the Material Properties of Complex Oxide Thin Films for Tunable Device Applications

S. Ramanathan, M. Cole, É. Ngo, 2011 .

RESIDUAL STRESS IN VERY THIN BARIUM STRONTIUM TITANATE FILMS

G. R. Martin, J. Demaree, W. Nothwang, 2008 .

GRAIN GROWTH AND RESIDUAL STRESS IN BST THIN FILMS

M. Cole, W. Nothwang, S. Hirsch, 2005 .

Modification of energy band alignment and electric properties of Pt/Ba0.6Sr0.4TiO3/Pt thin-film ferroelectric varactors by Ag impurities at interfaces

L. Alff, P. Komissinskiy, A. Klein, 2014 .

The Effects of Microwave Postgrowth Processing of BaSrTiO3 Thin Films on Their Dielectric Properties

J. Carroll, M. Ivill, É. Ngo, 2019, Coatings.

RESIDUAL STRESS OF Pt FILMS WITH Ti AND TiOx ADHESION LAYERS ON Si AND SAPPHIRE SUBSTRATES

M. Cole, C. Hubbard, S. Hirsch, 2010 .

DIRECT INTEGRATION OF THIN FILM PIEZOELECTRIC SENSORS WITH STRUCTURAL MATERIALS FOR STRUCTURAL HEALTH MONITORING

Victor Giurgiutiu, William D. Nothwang, Melanie W. Cole, 2006 .

DIELECTRIC RESPONSE OF VARIABLE THICKNESS Ba0.6Sr0.4TiO3 FILMS FOR PROPERTY-SPECIFIC DEVICE APPLICATIONS

S. Alpay, J. Demaree, C. Weiss, 2008 .