T. Suwa

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on a Printed Circuit Board in an Enclosure

T. Suwa, H. Hadim, H. Hadim, 2007, IEEE Transactions on Components and Packaging Technologies.

Multidisciplinary Electronic Package Design and Optimization Methodology Based on Genetic Algorithm

T. Suwa, H. Hadim, 2007, IEEE Transactions on Advanced Packaging.