T. Kamibayashi

Compensation of Surface Roughness Using an Au Intermediate Layer in a Cu Direct Bonding Process

N. Suzuki, T. Nonaka, H. Noma, 2018, Journal of Electronic Materials.

High-Color-Purity Microfluidic Quantum Dots Light-Emitting Diodes Using the Electroluminescence of the Liquid Organic Semiconductor Backlight

S. Shoji, T. Kasahara, J. Mizuno, 2019, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII).

Development of face-to-face and face-to-back ultra-fine pitch Cu-Cu hybrid bonding

T. Hirano, H. Iwamoto, Y. Kagawa, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

Fabrication of self-standing curved film with pillar arrays by large area spherical soft-UV imprint lithography

S. Shoji, J. Mizuno, H. Kuwae, 2017, 2017 International Conference on Electronics Packaging (ICEP).

Liquid/solution-based microfluidic quantum dots light-emitting diodes for high-colour-purity light emission

S. Shoji, T. Kasahara, J. Mizuno, 2020, Scientific Reports.

RGB all Liquid-Based Microfluidic Quantum Dots Light-Emitting Diodes Using Deep-Blue Liquid Organic Semiconductor Backlight

S. Shoji, T. Kasahara, J. Mizuno, 2020, 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS).

Low-Temperature Quasi-Direct Copper–Copper Bonding with a Thin Platinum Intermediate Layer Prepared by Atomic Layer Deposition

S. Shoji, J. Mizuno, H. Kuwae, 2020, Transactions of The Japan Institute of Electronics Packaging.