M. Shih

An Investigation of Wafer Probe Needles Mechanical Properties and Contact Resistance Changing Under Multiprobing Process

De-Shin Liu, M. Shih, Fangzhi Zheng, 2008, IEEE Transactions on Components and Packaging Technologies.

Application of a Genetic Algorithm to the Design Optimization of a Multilayer Probe Card for Wafer-Level Testing

De-Shin Liu, Chi-Ming Chang, Meng-Kae Shih, 2009 .