Xin Wei
发表
Hongren Gong,
Yiren Sun,
Zhuang Zhang,
2020
.
P. Lall,
J. Suhling,
S. Hamasha,
2020,
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
F. Akkara,
M. Belhadi,
Haneen Ali,
2020
.
Wenming Tang,
Lei Yang,
Guohong Chen,
2021
.
Yinchuan Guo,
Z. Lyu,
Yue Li,
2021
.
P. Lall,
B. Prorok,
S. Hamasha,
2021,
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
P. Lall,
B. Prorok,
S. Hamasha,
2022,
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
P. Lall,
S. Hamasha,
M. Belhadi,
2022,
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
P. Lall,
S. Hamasha,
Xin Wei,
2021,
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
A. Alahmer,
J. Evans,
S. Hamasha,
2022,
Materials.
Chunyu Feng,
Xin Wei,
Cong Shen,
2020,
Journal of Failure Analysis and Prevention.
P. Lall,
J. Suhling,
S. Hamasha,
2021,
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
P. Lall,
S. Hamasha,
Sinan Su,
2019,
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
S. Hamasha,
Haneen Ali,
Xin Wei,
2022,
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
A. Alahmer,
S. Hamasha,
Xin Wei,
2023,
Microelectronics Reliability.
A. Alahmer,
S. Hamasha,
M. Belhadi,
2023,
IEEE Transactions on Components, Packaging, and Manufacturing Technology.
A. Alahmer,
N. Sakib,
B. Prorok,
2022,
Journal of Electronic Packaging.
P. Lall,
J. Suhling,
S. Hamasha,
2020,
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
A. Alahmer,
M. Hamasha,
S. Hamasha,
2023,
Materials.
A. Alahmer,
S. Hamasha,
M. Belhadi,
2022,
Journal of Electronic Packaging.
Kai Guo,
Jie Sun,
Zhuoliang Zan,
2021,
The International Journal of Advanced Manufacturing Technology.
Hehua Zhu,
Wenqi Ding,
Zhiguo Yan,
2013
.
Huiqin Wu,
Rongjun Pan,
Xin Wei,
2020,
IOP Conference Series: Earth and Environmental Science.