Q. Pan

Strength and electrical conductivity behavior of nanoparticles reaction on new alumina dispersion-strengthened copper alloy

Shufeng Li, Z. Cao, Yabo Fu, 2019, Journal of Alloys and Compounds.

A new process for the preparation of polyimide/silica hybrid films

D. Lin, Yun-tao Li, Y. H. Zhang, 2005 .

Improvements in transmittance, mechanical properties and thermal stability of silica–polyimide composite films by a novel sol–gel route

S. Fu, Yuanqing Li, C. Yue, 2007 .

A Preliminary Study on Cryogenic Mechanical Properties of Epoxy Blend Matrices and SiO2/Epoxy Nanocomposites

Y. Mai, L. Ye, S. Fu, 2006 .