Di Zhao

The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

Chaowu Zhang, Cong Cao, Keke Zhang, 2019, Metals.

Relationship of the Microstructure and Toughness of the Coarse Grain Heat-Affected Zone of TiNbV Microalloyed Steels Based on Electron Backscatter Diffraction Analysis

X. Leng, H. Yan, Di Zhao, 2021, Journal of Materials Engineering and Performance.

Synthesis and Characterization of Nanostructured WCCo / Al Powder Prepared by Mechanical Alloying

Zhiwei Zhu, D. Yin, F. Ye, 2016 .

Influence of Ultrasonic Vibration Power on the Wettability and Interfacial Microstructure of Sn2.5Ag0.7Cu0.1RE0.05Ni Solder Alloy on Cu Substrate

Keke Zhang, Di Zhao, Jianguo Cui, 2018, IOP Conference Series: Materials Science and Engineering.

Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

Keke Zhang, Di Zhao, Yibo Pan, 2021, Scientific Reports.

Microstructure and properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

Keke Zhang, Di Zhao, Yibo Pan, 2020 .

Effect of ultrasonic vibration on the interfacial IMC three-dimensional morphology and mechanical properties of Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu halogen free solder joints

Keke Zhang, Di Zhao, N. Ma, 2018, Journal of Materials Science: Materials in Electronics.

Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

F. Huo, Keke Zhang, Di Zhao, 2020, Materials.