Qingqian Li

Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin–silver–copper (Sn–Ag–Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates

Y. Chan, Tama Fouzder, Daniel K. Chan, 2014, Journal of Materials Science: Materials in Electronics.

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

N. Lee, J. Lau, J. Lo, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Study of microstructure evolution in novel Sn-Zn/Cu bi-layer and Cu/Sn-Zn/Cu sandwich structures with nanoscale thickness for 3D packaging interconnection

Y. Chan, Kaili Zhang, K. Yung, 2014 .

Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn–Cu binary and Cu–Sn–Cu sandwich structures

Y. Chan, Qingqian Li, 2013 .

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

Y. Chan, Qingqian Li, Huayu Sun, 2014, Journal of Materials Science: Materials in Electronics.

Tin whiskers growth of SnAgIn solder on Kovar substrate with Au/Ni plating

Y. Chan, Zhong Chen, Qingqian Li, 2014, Journal of Materials Science: Materials in Electronics.

Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin–zinc–bismuth (Sn–8Zn–3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates

Y. Chan, Tama Fouzder, Daniel K. Chan, 2014, Journal of Materials Science: Materials in Electronics.

Thermal analysis of high brightness flip-chip LED packages

Y. Chan, Qingqian Li, P. Qin, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.