Chee-Yee Chung

Package capacitors impact on microprocessor maximum operating frequency

A. Waizman, Chee-Yee Chung, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Design and performance evaluation of chip capacitors on microprocessor packaging

Chee-Yee Chung, David G. Figueroa, Yuan-Liang Li, 1999, IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412).

Extended adaptive voltage positioning (EAVP) [power delivery network design]

Chee-Yee Chung, Alex Waizman, 2000, IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524).

Achieving 800 MT/s performance with PGA370 socket

A. Waizman, Chee-Yee Chung, 1999, IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412).

Resonant free power network design using extended adaptive voltage positioning (EAVP) methodology

A. Waizman, Chee-Yee Chung, 2001 .

Achieving 3.2 Gb/s, 400 MTS AGTL+ IO through robust power delivery design with minimal package size

Weimin Shi, Chee-Yee Chung, Alex Waizman, 2002 .

Optimum signal integrity through appropriate analysis of signal return path and power delivery

A. Waizman, Chee-Yee Chung, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Low cost flip chip package design concepts for high density I/O

Chee-Yee Chung, Robert L. Sankman, Teong-Guan Yew, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).