Yeongbong Park

Preliminary study on the effect of spray slurry nozzle in CMP for environmental sustainability

Hyunseop Lee, Haedo Jeong, Sangjik Lee, 2014 .

Structural effect of PVA brush nodule on particle removal efficiency during brush scrubber cleaning

Haedo Jeong, J. An, Yeongbong Park, 2012 .

Effect of contact angle between retaining ring and polishing pad on material removal uniformity in CMP process

Hyunseop Lee, Haedo Jeong, Sunjoon Park, 2013 .

Planarization of wafer edge profile in chemical mechanical polishing

Hobin Jeong, Yeongbong Park, Hobin Jeong, 2013 .

Effect of wafer size on material removal rate and its distribution in chemical mechanical polishing of silicon dioxide film

Sangjik Lee, Yeongbong Park, Hyunseop Lee, 2013 .

Effect of wafer size on material removal rate and its distribution in chemical mechanical polishing of silicon dioxide film

Hyunseop Lee, Haedo Jeong, Sangjik Lee, 2013, Journal of Mechanical Science and Technology.

Effect of contact angle between retaining ring and polishing pad on material removal uniformity in CMP process

Hyunseop Lee, Youngkyung Lee, Haedo Jeong, 2013, International Journal of Precision Engineering and Manufacturing.