N. Tanaka

Au Bump Interconnection in 20 µm Pitch on 3D Chip Stacking Technology

Kazumasa Tanida, Mitsuo Umemoto, Yoshihiro Tomita, 2003 .

Micro Cu Bump Interconnection on 3D Chip Stacking Technology

Y. Tomita, Kenji Takahashi, K. Tanida, 2004 .

Layer structure formation of mesogenic liquid crystalline epoxy resin during curing reactions: A reactive coarse-grained molecular dynamics study

Hiroshi Ito, N. Maruyama, H. Moriya, 2021, Mechanical Engineering Journal.

A New Method for Measuring Adhesion Strength of IC Molding Compounds

A. Nishimura, N. Tanaka, I. Hirose, 1992 .

Reliability of Adhesively Conductive Technique

T. Ikeda, N. Tanaka, 2005 .

Prediction of Adhesion Strength for IC Plastic Package Under Humid Conditions—Fracture Mechanics Approach

N. Tanaka, 2013 .

Evaluating IC-package interface delamination by considering moisture-induced molding-compound swelling

Asao Nishimura, Naotaka Tanaka, T. Kumazawa, 1999 .

Evaluation of interface delamination in IC packages by considering swelling of the molding compound due to moisture absorption

Asao Nishimura, Naotaka Tanaka, T. Kumazawa, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

Measurement of IC Molding Compound Adhesion Strength and Prediction of Interface Delamination Within Package.

A. Nishimura, N. Tanaka, 1994 .

A Theoretical Study of Growth of Solid-Electrolyte-Interphase Films in Lithium-Ion Batteries with Organosilicon Compounds

K. Kojima, N. Tanaka, M. Hoshino, 2019, MRS Advances.