Shugo Ishizuka

A Metal Bump Bonding Method Using Ag Nanoparticles as Intermediate Layer

S. Shoji, T. Kasahara, J. Mizuno, 2015, Journal of Electronic Materials.

Injection of synthesized FePt nanoparticles in hole-patterns for bit patterned media

T. Osaka, J. Mizuno, Taku Hachisu, 2012 .

Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

S. Shoji, T. Kasahara, J. Mizuno, 2013, 2013 3rd IEEE CPMT Symposium Japan.