K. Tsai

发表

Reduction of etching plasma damage on low dielectric constant fluorinated amorphous carbon films by multiple H2 plasma treatment

J. Shieh, B. Dai, Y. S. Wu, 2002 .

Improvements of characteristics of fluorinated dielectric films integrated as interlayer dielectrics

J. Shieh, B. Dai, K. Tsai, 2002 .

Inductively Coupled Plasma Deposited Silicon Oxycarbide Interlayers

J. Shieh, B. Dai, K. Tsai, 2003 .

Influence of bias-temperature stressing on the electrical characteristics of SiOC:H film with Cu/TaN/Ta-gated capacitor

C. Chao, Wen-Fa Wu, K. Tsai, 2006 .

High-Reliability Ta2O5 Metal–Insulator–Metal Capacitors with Cu-Based Electrodes

C. Chao, Wen-Fa Wu, K. Tsai, 2006 .

Characteristics of fluorinated amorphous carbon films and implementation of 0.15 μm Cu/a-C:F damascene interconnection

J. Shieh, B. Dai, Y. S. Wu, 2001 .

Alkylation of nanoporous silica thin films by high density plasma chemical vapor deposition of a-SIC:H

J. Y. Chen, K. Chao, F. Pan, 2004 .

Low hydrogen content in trimethylsilane-based dielectric barriers deposited by inductively coupled plasma

J. Shieh, B. Dai, K. Tsai, 2002 .

Influences of Ti, TiN, Ta and TaN layers on integration of low-k SiOC:H and Cu

C. Chao, Wen-Fa Wu, K. Tsai, 2007 .

Improving Electrical Properties and Thermal Stability of (Ba,Sr)TiO3 Thin Films on Cu(Mg) Bottom Electrodes

Shih-Wen Shen, C. Chao, Wen-Fa Wu, 2006 .

Vacuum flashover on diamond-like carbon-coated insulators

M. Horenstein, T. Moustakas, W. Halverson, 1996 .

Influence of N2O plasma treatment on microstructure and thermal stability of WNx barriers for Cu interconnection

C. Chao, Wen-Fa Wu, J. Y. Chen, 2004 .

Improving electrical characteristics of Ta/Ta2O5/Ta capacitors using low-temperature inductively coupled N2O plasma annealing

Chuen-Guang Chao, C. Chao, C. Wu, 2007 .

Numerical and Experimental Analysis of Cu Diffusion in Plasma-Treated Tungsten Barrier

C. Chao, Wen-Fa Wu, K. Tsai, 2005 .

Modifications of Low Dielectric Constant Fluorinated Amorphous Carbon Films by Multiple Plasma Treatments

Jia-Min Shieh, Bau-Tong Dai, Shih-Chin Lee, 2002 .

Novel multilayered Ti/TiN diffusion barrier for Al metallization

C. Chao, K. Ou, K. Tsai, 2005 .