Hailong Li

Electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu ball grid array solder joints

Meiyu Wang, Y. Mei, Yi-Jian Jiang, 2019, Journal of Materials Science: Materials in Electronics.

Effects of Mn addition on crystallization behavior and soft magnetic properties of Fe–Si–B–P–Cu nanocrystalline alloy

Yahui Cui, Ran Wei, Wenzhong Zhu, 2022, Journal of Materials Science: Materials in Electronics.

Fabrication of high Tc BaTiO3–Bi0.5Na0.5TiO3 positive temperature coefficient of resistivity ceramics using the sol–gelmethod

De’an Yang, Hailong Li, Y. Qu, 2013 .

Effect of the Nb2O5 content on electrical properties of lead-free BaTiO3–Bi0.5Na0.5TiO3 ceramics

De’an Yang, Hailong Li, F. Guo, 2013 .

Effect of Ni on the Au embrittlement in Sn/Au/Ni solder bump

Hailong Li, Xuehong Zhang, Shiguang Hao, 2021, Journal of Materials Science: Materials in Electronics.

Effect of nickel metallization thickness on microstructure evolution and mechanical properties in Sn3.0Ag0.5Cu/Au/Ni/Cu solder joints

Hailong Li, Gang Chen, Yutao Lin, 2020, Journal of Materials Science: Materials in Electronics.

Effect of twin grain boundary on the diffusion of Cu in bulk β-Sn

Hailong Li, Shiguang Hao, 2023, Computational Materials Science.

First-Principles Calculations on Physical Properties of α-CoSn3 Intermetallic Compound and β-Sn/α-CoSn3 Interface

Xin Li, Hailong Li, Xuehong Zhang, 2021, Journal of Electronic Materials.