Y. Chiu

发表

Electromigration of 96.5Sn-3Ag-0.5Cu flip-chip solder bumps bonded on substrate pads of Au/Ni/Cu or Cu metallization

Y. Lai, C. Lee, Y. Chiu, 2006, 56th Electronic Components and Technology Conference 2006.

Electromigration Reliability With Respect to Cu Weight Contents of Sn–Ag–Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing

Y. Lai, Y. Chiu, 2008 .

Failure Mechanism of Sn-Ag-Cu Flip-chip Solder Joints with Different Cu Weight Contents Under Comparatively Low Current Stressing

Y. Lai, Y. Chiu, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Electro-dissolution of the Bi second phase in Sn5Bi solder alloy

Kwang-Lung Lin, Tsung-Chieh Chiu, Y. Chiu, 2015 .

Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

Y. Lai, Y. Chiu, Jiunn Chen, 2008, 2008 58th Electronic Components and Technology Conference.

Electromigration reliability and morphologies of Cu pillar flip-chip solder joints

Y. Lai, C. Lee, Y. Chiu, 2008, ECTC 2008.

Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates

Y. Lai, Yu-Lin Shen, Jenn-Ming Song, 2009 .

Microcosmic mechanisms of Cu to Cu bonding by molecular dynamic simulation

M. Shih, S. Jian, Y. Chiu, 2017, 2017 IEEE CPMT Symposium Japan (ICSJ).

Enhanced Cu-to-Cu direct bonding by controlling surface physical properties

Jenn-Ming Song, C. Hung, Y. Chiu, 2017 .

The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation

Y. Lai, Kwang-Lung Lin, K. Lu, 2012 .

The corrosion behavior of Ag alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Kwang-Lung Lin, Louie Huang, C. Hung, 2016, 2016 International Conference on Electronics Packaging (ICEP).

The IMC formation and progress in the copper pillar Cu/Sn1.8Ag /OSP-Cu microbump structure upon current stressing

Kwang-Lung Lin, C. Kao, Ping-Feng Yang, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy

Yi-Shao Lai, Chin-Li Kao, Ying-Ta Chiu, 2007, Microelectron. Reliab..

Ball Impact Reliability of Zn-Sn High-Temperature Solder Joints Bonded with Different Substrates

Y. Lai, Jenn-Ming Song, Y. Chiu, 2013, Journal of Electronic Materials.

The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests

S. Lee, M. H. Chen, T. Lin, 2018, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).

Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid

Jenn-Ming Song, Ping-Feng Yang, Y. Chiu, 2014 .

Electrorecrystallization of Metal Alloy

Y. Lai, C. Dong, Kwang-Lung Lin, 2013 .

Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps

Kwang-Lung Lin, C. Lee, Y. Chiu, 2017 .

Effect of minor alloying additions on the BIT reliability of SnAgCu solder joints

Y. Lai, Jenn-Ming Song, Y. Chiu, 2009, 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.

Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization

Yi-Shao Lai, Ying-Ta Chiu, Chiu-Wen Lee, 2009 .

Reliability and Failure Mechanism of Current-Stressed 99.3Sn-0.7Cu/96.5Sn-3Ag-0.5Cu Composite Flip-Chip Solder Joints with Cu or Au/Ni/Cu Substrate Pad Metallization

Y. Lai, Y. Chiu, Yu-Hsiu Shao, 2008, 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.

Orientation transformation of Pb grains in 5Sn–95Pb/ 63Sn–37Pb composite flip-chip solder joints during electromigration test

Y. Lai, Kwang-Lung Lin, Y. Chiu, 2008 .

The growth and segregation of intermetallic compounds in the bulk of flip chip Sn2.4Ag solder joint under electrical current stressing

Y. Lai, Kwang-Lung Lin, Y. Chiu, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Nanomechanical responses of intermetallic phase at the solder joint interface – Crystal orientation and metallurgical effects

Y. Lai, Tzu-Wen Huang, Jenn-Ming Song, 2012 .

Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints

Y. Lai, Jenn-Ming Song, Y. Chiu, 2009, 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.

Dissolution of Sn in a SnPb solder bump under current stressing

Y. Lai, Kwang-Lung Lin, Y. Chiu, 2012 .

Intermetallic formation induced substrate dissolution in electroless Ni(P)-solder interconnections

Yi-Shao Lai, Ying-Ta Chiu, Jenn-Ming Song, 2008 .

Electromigration-induced accelerated consumption of Cu pad in flip chip Sn2.6Ag solder joints

Y. Lai, Y. Chiu, W. Deng, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints

Yi-Shao Lai, Ying-Ta Chiu, Jenn-Ming Song, 2008 .

Low temperature direct Cu bonding for MEMS packaging

Jenn-Ming Song, D. Tarng, Jing-Yuan Lin, 2017, 2017 International Conference on Electronics Packaging (ICEP).

Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints

Yi-Shao Lai, Ying-Ta Chiu, Jenn-Ming Song, 2012, Microelectron. Reliab..

Light enhanced direct Cu bonding for advanced electronic assembly

Jenn-Ming Song, D. Tarng, C. Hung, 2018, Journal of Materials Science: Materials in Electronics.

A comparison study of electromigration performance of Pb-free flip chip solder bumps

P. Su, Li Li, Y. Lai, 2009, 2009 59th Electronic Components and Technology Conference.

Impact test performance of Zn-based die-attach joints for power devices

Y. Lai, Jenn-Ming Song, Y. Chiu, 2012, 2012 2nd IEEE CPMT Symposium Japan.

Metallurgical Perspective on Alloying Modification of Sn-Ag-Cu Solders

N. Lee, Y. Lai, Jenn-Ming Song, 2008, 2008 10th Electronics Packaging Technology Conference.

The corrosion performance of Cu alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Kwang-Lung Lin, Louie Huang, Ping-Feng Yang, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Supersaturation induced by current stressing

Y. Lai, Kwang-Lung Lin, Y. Chiu, 2011 .

Alloying modification of Sn-Ag-Cu solders by manganese and titanium

Li-Wei Lin, Yi-Shao Lai, Ying-Ta Chiu, 2009, Microelectron. Reliab..